On September 29, 2023, CHIPS for America unveiled its second funding opportunity, aimed at fortifying the resilience of the semiconductor supply chain, bolstering U.S. technological leadership, and fostering robust domestic semiconductor clusters.
This funding initiative is currently inviting project proposals centered around the construction, expansion, or modernization of commercial facilities for the production of cutting-edge, contemporary, and established-node semiconductors, provided the capital investment more than $20 million but does not exceed $300 million.
This funding opportunity is an extension of the Department's prior announcement in June 2023, wherein they broadened their financial backing to encompass more extensive supply chain initiatives. In February 2023 the Department of Commerce released its first funding opportunity tailored toward large scale supply chain projects that exceeded or equal the amount of $300 million of capital investment to incentivize investment in construction, expansion, or modernization of commercial facilities of semiconductor materials and manufacturing equipment facilities. As articulated in the initial press release to accompany this second funding opportunity for small scale supply chain projects, 'In alignment with President Biden's Investing in America agenda, the bipartisan CHIPS and Science Act incorporates incentives aimed at fortifying supply chains, aiding smaller ventures and enterprises, and fostering the creation of well-compensated employment opportunities within local communities nationwide.
Who can apply?
- To be eligible for CHIPS Incentives:
- The applicant must be a "covered entity."
- A "covered entity" can be:
- A nonprofit organization
- A private-sector company
- A consortium formed by private-sector entities
- A consortium composed of nonprofit, public, and private-sector entities
- The entity must demonstrate the capability to significantly finance, construct, expand, or modernize facilities related to semiconductor activities such as fabrication, assembly, testing, advanced packaging, production, or research and development.
- Eligibility is based on the entity's ability to support semiconductor-related infrastructure projects.
How to Apply?
- How to Access an Application Package
- Application forms and instructions are available on the CHIPS Incentives Program application portal. FAQs, guides and templates are available at https://www.chips.gov.
When is the application period?
The application process includes two primary phases. In the first phase, applicants will be asked to submit a concept plan describing how their proposed project addresses core program priorities.
- For all potential applicants, concept plans will be accepted between December 1, 2023, and February 1, 2024.
- For applications that are invited to advance to the full application phase, the CHIPS Program Office will communicate full application submission dates to applicants individually upon notifying them of their advancement.
Additional Resources
